Manufacturing apparatus and manufacturing method of light-emitting element

ABSTRACT

Disclosed is a manufacturing apparatus of a light-emitting element. The manufacturing apparatus includes: a main transporting route including a first transfer device and a second transfer device connected to each other through a first transporting chamber; a sub-transporting route extending in a direction intersecting the main transporting route, the sub-transporting route including: a second transporting chamber connected to the first transfer device or the second transfer device; and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber. A region to which the first transfer device, the second transfer device, the first transporting chamber, and the second transporting chamber are connected is under a continuous vacuum environment.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims the benefit of priority from the prior Japanese Patent Application No. 2016-115945, filed on Jun. 10, 2016, the entire contents of which are incorporated herein by reference.

FIELD

The present invention relates to a manufacturing apparatus and a manufacturing method of a light-emitting element. Particularly, the present invention relates to a manufacturing apparatus and a manufacturing method of an organic layer and an electrode layer which structure an organic EL element of a display device.

BACKGROUND

In recent years, a display device using an organic electroluminescence element (organic EL element) in a display portion has been widely employed in a variety of electronic devices including a portable information terminal such as a smartphone. An organic EL element has a structure in which organic layers having respective functions are stacked and sandwiched between a pair of electrodes. Manufacture of an organic EL element is achieved by sequentially forming, over a substrate over which one of the electrodes is fabricated, organic layers with an evaporation method, an application method, and the like and then forming the other electrode with a sputtering method, an application method, and the like.

A stacked structure of a hole-injection layer/hole-transporting layer/emission layer/electron-transporting layer/electron-injection layer is represented as a typical structure of organic layers of an organic EL element. A manufacturing apparatus for sequentially and appropriately forming stacked layers constructing an organic EL element, which are exemplified by the aforementioned stacked structure, has been proposed (for example, see Japanese patent application publication No. 2004-288463).

SUMMARY

An organic EL element is structured with a stack of organic layers sandwiched between a pair of electrodes, and its structure strongly depends on required characteristics. Therefore, a proposal of an element having a material and a stacked-layer structure different from those of traditional organic EL elements requires construction of a manufacturing apparatus suitable for the element. For example, in the manufacturing apparatus described in the Japanese patent application publication No. 2004-288463, delivery chambers to which a plurality of treatment chambers is connected are connected in series through transporting chambers. In the case of such a structure, when the stacked-layer structure is changed or a new layer is additionally provided, large-scale reconstruction is necessary which includes dismantling and rearranging a part of the apparatus groups already arranged or adding and connecting a new delivery chamber. Additionally, each treatment is different in treatment time. Hence, there is a difference in treatment so that a chamber may have a high treatment ability in a certain process but exhibit a poor treatment ability in another process. When delivery chambers are connected in series, a process conducted in a treatment chamber with a poor ability becomes a bottleneck and determines throughput of the whole of the manufacturing process.

A manufacturing apparatus of a light-emitting element according to an embodiment of the present invention includes: a main transporting route including first and second transfer devices connected to each other through a first transporting chamber; a sub-transporting route extending in a direction intersecting with the main transporting route, the sub-transporting route including: a second transporting chamber connected to the first or second transfer device; and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber. A region to which the first and second transfer devices, the first transporting chamber, and the second transporting chamber are connected is under a continuous vacuum environment.

A manufacturing apparatus of a light-emitting element according to another embodiment of the present invention includes: a main transporting route including first and second transfer devices connected to each other through a first transporting chamber; a delivery chamber connected to the first or second transfer device through a second transporting chamber in a direction intersecting with the main transporting route; and a plurality of treatment chambers connected to the delivery chamber. The first transfer device or the second transfer device has a first port to which the first transporting chamber is connected; a second port to which the second transporting chamber is connected; and a third port to which a buffer for storing a substrate to be treated is connected. The delivery chamber includes: a fourth port to which the second transporting chamber is connected; and a fifth port to which one of the plurality of treatment chambers is connected. At least two first transporting chambers are arranged in parallel.

A manufacturing method of a light-emitting element according to another embodiment of the present invention is a manufacturing method of a light-emitting element with a manufacturing apparatus for a light-emitting element, the manufacturing apparatus including: a main transporting route including first and second transfer devices connected to each other through a first transporting chamber; a first delivery chamber connected to the first transfer device through a second transporting chamber in a direction intersecting with the main transporting route; a second delivery chamber connected to the second transfer device through a third transporting chamber in a direction intersecting with the main transporting route; a first treatment chamber connected to the first delivery chamber; and a second treatment chamber connected to the second delivery chamber. The manufacturing method includes: preparing a substrate to be treated, the substrate including, over an insulating surface, a pixel electrode and a bank covering an edge portion of the pixel electrode and exposing a part of the pixel electrode; transporting the substrate into the first transfer device on the main transporting route of the manufacturing apparatus; transporting the substrate from the first transfer device to the first delivery chamber through the second transporting chamber; transporting the substrate from the first delivery chamber to the first treatment chamber connected to the first delivery chamber; forming a first organic layer over the pixel electrode and the bank; returning the substrate from the first treatment chamber to the first delivery chamber; returning the substrate from the first delivery chamber to the first transfer device through the second transporting chamber; transporting the substrate from the first transfer device to the second transfer device on the main transporting route; transporting the substrate from the second transfer device to the second delivery chamber through the third transporting chamber; transporting the substrate from the second delivery chamber to the second treatment chamber connected to the second delivery chamber; forming a second organic layer over the first organic layer in a region overlapping with the pixel electrode; returning the substrate from the second treatment chamber to the second delivery chamber; and returning the substrate from the second delivery chamber to the second transfer device through the third transporting chamber. The substrate is placed under a vacuum environment throughout the main transporting route, the second transporting chamber, the first delivery chamber, the first treatment chamber, the third transporting chamber, the second delivery chamber, and the second treatment chamber.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a drawing showing a manufacturing apparatus of a light-emitting element according to an embodiment of the present invention;

FIG. 2 is a drawing showing a manufacturing apparatus of a light-emitting element according to an embodiment of the present invention;

FIG. 3 is a drawing showing a manufacturing apparatus of a light-emitting element according to an embodiment of the present invention;

FIG. 4 is a drawing showing a structural example of a conventional manufacturing apparatus of a light-emitting element;

FIG. 5A to FIG. 5F are drawings showing a fabrication process of an organic EL element;

FIG. 6 is a drawing showing a manufacturing apparatus of a light-emitting element according to an embodiment of the present invention; and

FIG. 7 is a drawing showing a manufacturing apparatus of a light-emitting element according to an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the embodiments of the present invention are explained with reference to the drawings. The drawings may be illustrated so that the width, thickness, shape, and the like are illustrated more schematically compared with those of the actual modes in order to provide a clearer explanation. However, unless particularly specified, they are only an example and do not limit the interpretation of the invention. In addition, in the specification and the drawings, the same reference number is provided to an element that is the same as that which appears in preceding drawings, and a detailed explanation may be omitted as appropriate.

Furthermore, in the specification, unless specifically stated, when a state is expressed where a structure is arranged “over” another structure, such an expression includes both a case where the substrate is arranged immediately above the “other structure” so as to be in contact with the “other structure” and a case where the structure is arranged over the “other structure” with an additional structure therebetween.

FIG. 1 shows a structural example of a manufacturing apparatus 100 of a light-emitting element according to an embodiment of the present invention. In FIG. 1, a section structured by transfer devices 101 to 103 and conveyors (transporting chambers) 111 to 113 is a main transporting route, and treatment devices A to E are connected, through conveyors 131 to 135, to the main transporting route in a branch form in a direction intersecting with the main transporting route. Reference number 110 is an inlet/outlet for a substrate and is connected to a substrate stocker (not shown), for example. The conveyors 111 to 113 and 131 to 135 undergo transportation of a substrate to be treated between the adjacent transfer devices or between the transfer device and delivery chambers 191 to 195 of the treatment devices A to E. In FIG. 1, the main transporting route has a linear shape. However, the main transporting route is not limited to this shape, and the transfer devices 101 to 103 and the conveyors 111 to 113 constructing the main transporting route may be connected in a unicursal line shape in this example.

The transfer device 101 has a plurality of ports, and the conveyors 111, 112, 131, and 134 are connected thereto through the ports. The transfer device 101 possesses a transfer arm 161 and transfers a substrate to be treated to/from the conveyors 111, 112, 131, and 134. One or a plurality of buffers 162 may be connected to the transfer device 101. The buffers 162 are used in order to temporally retract a substrate to be treated in a waiting state for being input to the apparatus. When the treatment chambers A to E are different in treatment ability, it is possible to prevent the substrates from being piled up on the main transporting route without interference between the substrates arranged in the transport sequence. In FIG. 1, two buffers are connected to the transfer device 101. However, it is sufficient that only a necessary number of the buffers are connected to each transfer device, and the transfer device may possess a vacant port 163.

The treatment device A is structured by the delivery chamber 191 having a transfer arm 152 to which a plurality of chambers (treatment chambers) 152 in which each treatment is conducted is connected. Each chamber is connected to the delivery chamber 191 through a port. Each port possesses a load lock gate 153. The load lock gate 153 is airtight so as to place each section of the apparatus under a vacuum environment or a specific atmosphere depending on necessity and possesses a mechanism to insulate a space continuing inside the load lock gate 153 from a space outside the load lock gate 153. In FIG. 1, the delivery chamber 191 has 8 ports, and one of the ports is occupied for connection to the conveyor 131. Thus, a maximum of 7 chambers can be connected thereto. It is sufficient that only a necessary number of the chambers for each process are connected, and the delivery chamber 191 may possess a vacant port 154. The same is applied to other treatment devices B to E.

The conveyors 111 to 113 and 131 to 135 of FIG. 1 have a conveyor structure where a substrate is transported therein. However, in the case where a distance between the transfer devices or between the transfer device and the treatment device is not relatively long and a substrate to be treated can be transferred within an operation range of the transfer arm 161, the conveyors may simply have a structure in which a stage over which a substrate to be treated is disposed is provided.

In the manufacturing apparatus of a light-emitting element according to an embodiment of the present invention, a region in which the transfer devices 101 to 103, the conveyors 111 to 113 provided on the main transporting route, and the conveyors 131 to 135 arranged in a branch shape are connected is kept in a vacuum state. Therefore, when a substrate to be treated is shuttled between the plurality of treatment devices, the substrate is not exposed to air during processing.

FIG. 2 shows an implementation example of a treatment process. The arrows roughly indicate a route of a substrate to be treated. A substrate to be treated is transported to the transfer device 101 from the inlet/outlet 110 through the conveyor 111. The transfer device 101 inputs, via the conveyor 131, the substrate to be treated to the delivery chamber 191 of the treatment device A in which a first treatment is performed. In the treatment device A, respective treatments are carried out while transferring the substrate to be treated between the delivery chamber 191 and treatment chambers. After all of the process steps are completed in the treatment device A, the transfer device 101 receives the substrate to be treated from the conveyor 131 and transports the substrate to the conveyor 134.

After that, the process is sequentially carried out in the treatment devices B, C, D, and then E, and the substrate to be treated is brought back again to the inlet/outlet 110 after all steps in the treatment chambers are completed.

A main characteristic of the manufacturing apparatus of a light-emitting element according to an embodiment of the present invention is that each of the treatment devices A to E is connected to the main transporting route in a branch form through the conveyors 131 to 135. For example, as shown in FIG. 2, it is possible not only to sequentially execute a process according to the order of the treatment devices A, B, C, D, and then E but also adapt the manufacturing apparatus to a variation of the order of the treatment devices to A, E, C, D, and then B due to a change of the stacked-layer structure even though the connection of each treatment device is not changed.

Additionally, process steps conducted in the chambers connected to each of the treatment devices may not be always carried out sequentially, and a treatment in the same chamber may be conducted a plurality of times in different process steps. In such a case, a substrate to be treated is also readily shuttled on the main transporting route.

Even if the order of the treatment devices employed becomes complicated, the buffer permits the substrates to be readily refuged and pass each other. The same can be applied in the case where a plurality of substrates to be treated is input to the manufacturing apparatus.

The vacant port 164 of the transfer device 102 and the vacant port 165 of the transfer device 103 provide future extensibility. For example, it is possible to additionally connect a treatment device 170 (see FIG. 1) and increase a process number by further connecting a conveyor.

The manufacturing apparatus of a light-emitting element according to an embodiment of the present invention has flexibility to such expansion. For example, a treatment device 170 additionally connected to the vacant port 164 may be a device for a treatment which is carried out during another treatment conducted in another treatment device. For example, when a new treatment device F is additionally required to reconstruct a process performed in the order of the treatment devices A, B, C, D, and then E into a process performed in the order of the treatment devices A, F, B, C, D, and then E, such a reconstruction can be readily achieved by adding the treatment device F by using the vacant port 164. It is not necessary to move the existing equipment including other treatment devices A to E, the transfer devices 101 to 103, and the like.

All of the process steps conducted in the treatment devices do not always take the same treatment time, and it is not rare that a certain step requires a longer treatment time than the other steps. Thus, the treatment device which requires a long treatment time acts as a bottleneck, decreasing throughput of the whole of the manufacturing apparatus of a light-emitting element. In such a case, a treatment chamber used for the process requiring a long treatment time may be added and arranged in parallel by utilizing the vacant port 164. A plurality of substrates to be treated is divided for a parallel treatment, and the buffers 162 of each section are utilized, by which a process conducted in one treatment device and a process conducted in a plurality of treatment devices in parallel can be appropriately combined.

For example, fabrication of an organic EL element requires formation of each of a plurality of organic layers at a high purity in an individual step, and the film-formation is carried out under a vacuum, at a reduced pressure, or under a specific atmosphere. Hence, a large number of treatment chambers is necessary. Therefore, a scale of a manufacturing apparatus may become large, and a layout of a manufacturing apparatus may be difficult in view of a shape of a clean room and floorage. In the manufacturing apparatus of a light-emitting element according to an embodiment of the present invention, a degree of freedom in arrangement of the treatment devices connected in a branch shape can be increased by arranging the plurality of transfer devices on the main transporting route, thereby appropriately solving the aforementioned problem.

Additionally, when a device layout is strictly limited, a distance between the transfer devices, between the treatment devices, or between the transfer device and the treatment device may be increased by elongating a part of the conveyors. For example, as shown in FIG. 6, when the treatment devices A and C respectively possess treatment chambers 601 and 602 for single-wafer processing, and the treatment chambers B and D respectively have treatment chambers 603 and 604 for two-wafer processing, an arrangement of the manufacturing apparatus may be inadequate because the floorage of the treatment chambers 603 and 604 is obviously large. In such a case, the degree of freedom in arrangement of the treatment devices B and D can be increased by making the conveyor 620 longer than the conveyor 610.

FIG. 6 is illustrated so that the treatment chambers of the treatment devices A and C are each a chamber for single-wafer processing, while the treatment chambers of the treatment devices B and D are each a chamber for two-wafer processing. However, the manufacturing apparatus is not limited thereto, and a treatment chamber for single-wafer processing and a treatment chamber for two-wafer processing may be combined in one treatment device.

A X-X′ cross section of FIG. 1 is shown in FIG. 3. Elements already explained in FIG. 1 are provided with the same reference numbers. In FIG. 3, a section shown by 310, that is, the conveyor 111 and the transfer device 101 corresponds to the main transporting route, and a section shown by 320, that is, the conveyor 131 and the treatment device A are arranged in a branch shape from the main transporting route.

A substrate cassette 301 which stores substrates before being input to the manufacturing apparatus is provided to the inlet/outlet 110. A transfer arm 302 picks out a substrate to be treated from the substrate cassette 301 and transfers it to the conveyor 111. In FIG. 3, the conveyor 111 is illustrated so as to have a two-layer structure. This structure is used in order to increase efficiency in the case where the substrates to be treated shuttle on the main transporting route in the same period. As shown in FIG. 3, the conveyor 111 may be a one-way transport type in which an upper-layer conveyor and a lower-layer conveyor are respectively used for a forward direction and a reverse direction or a dual-direction transport type in which each of the conveyors can freely move in the forward and reverse directions. This structure allows the plurality of substrates to be treated pass each other on the main transporting route. Moreover, the conveyor 111 has two vertically stacked layers in FIG. 3. However, the conveyor 111 is not limited thereto, and the two layers may be arranged in a horizontal direction or a diagonal direction.

The transfer device 101 has the transfer arm 161 and transfers a substrate to be treated between the conveyor 111 and the conveyor 112 (not illustrated in FIG. 3) on the main transporting route or between the conveyor 111 on the main transporting route and the conveyor 132 linked to the delivery chamber 191 of the treatment chamber A. The conveyor 131 transfers a substrate to be treated to the delivery chamber 191 of the treatment device A. It is not necessary that a plurality of substrates to be treated be shuttled in the same period in this path. Hence, unlike the conveyor 111 belonging to the main transporting route, the conveyor 131 may be a dual-direction transport type having a single-layer structure. Of course, the conveyor 131 may also be a two-layer structure. When the main transporting route and the treatment device A can be brought sufficiently close to each other, the conveyor 131 may be simply a stage for disposing a substrate to be treated.

The treatment apparatus A takes a substrate to be treated with the transfer arm 152 provided to the delivery chamber 191 from the conveyor 131 and inputs the substrate to the chamber 151. Generally, a plurality of chambers is connected to the delivery chamber 191, and the treatment is conducted while a substrate to be treated is shuttled between the delivery chamber 191 and each chamber. After the treatment in the treatment chamber A is completed, a substrate to be treated is returned along the conveyor 131 and transported to the main transporting route.

The inlet/outlet 110, the conveyor 111, the transfer device 101, the conveyor 131, and the delivery chamber 191 are connected through ports. The chamber 151 is connected to the delivery chamber 191 through a port. The ports each have respective load lock gates 351 to 357. Since some of the steps implemented in the manufacturing apparatus 100 of a light-emitting element require a vacuum, a reduced pressure, or a specific atmosphere, each load lock gate possesses sufficient airtightness. In the treatment device, each chamber is able to possess a different atmosphere, and a region of minimum necessity is opened while transferring a substrate, thereby efficiently conducing substitution of an atmosphere and reduction of pressure.

The conveyors 111 and 131 each have a moving stage 303 supporting a substrate to be treated. In a manufacturing apparatus for a display device, a substrate is adsorbed with a vacuum chuck to avoid dislocation or a fall of the substrate from the stage 303 during movement. However, in an evaporation apparatus or the like of an organic EL element, a transporting path is kept under a vacuum to prevent exposure to air and adsorption with a vacuum chuck is difficult. As a countermeasure to prevent the dislocation and the fall of a substrate to be treated, a method is considered, for example, whereby pins to maintain a substrate to be treated on the stage 303 are provided so that the pins contact with a vicinity of a peripheral portion of the substrate but do not contact with a central portion of the substrate, allowing the substrate to be transported in a state where a center of the substrate is bent due to gravity. The central portion of the substrate is located at a lower position than the tips of the pins due to the bending, thereby preventing dislocation of the substrate in a lateral direction.

Alternatively, although not specifically illustrated, pegs for holding a substrate to be treated may be provided to the stage 303 to clamp an edge portion of the substrate, especially positions which do not influence the film formation.

Next, a manufacturing process of an organic EL element is explained by using FIG. 5A to FIG. 5F. FIG. 5A to FIG. 5F show a cross-sectional view of a display region of a display device 500. Pixel electrodes 502 and 503 are formed over an insulating surface 501. Here, a transistor for controlling each pixel, wirings for supplying a power source to the light-emitting element, and the like are fabricated in a layer under the insulating surface. A bank 504 is formed so as to cover edge portions of the pixel electrodes 502 and 503. Regions overlapping with the surfaces of the pixel electrodes 502 and 503 which are exposed from the bank 504 serve as an emission region formed later. The processes up to the formation of the pixel electrodes 502 and 503 and the bank 504 are conducted by photolithography and etching. A substrate in a state shown in FIG. 5A corresponds to the aforementioned substrate to be treated.

Here, a structure is explained where the pixel electrodes 502 and 503 serve as an anode of an organic EL element. When the pixel electrodes 502 and 503 serve as an anode, it is preferred to use a material with a high work function. In FIG. 5A, a structure in which emitted light is extracted on a lower side is called a bottom-emission mode. In this case, the pixel electrodes 502 and 503 are preferably prepared with a transparent conductive material such as ITO, IZO, and ZnO. These materials are preferred because transparency of the pixel electrodes allows light extraction and the work function is high. On the other hand, in the case of a top-emission mode where the emitted light is extracted on an upper side, a structure is represented in which Ag and the like is used, and the work function of a surface is increased by forming a thin layer of ITO on the upmost surface because reflectivity is required for the pixel electrodes 502 and 503.

As shown in FIG. 5B, a hole-transporting layer 505 is first formed over the substrate to be treated. As a hole-transporting material, a triarylamine derivative, a bisstyrylamine derivative, or the like is preferred, and α-NPD, TPD, TPAC, Spiro-TPD, PDA, m-MTDATYA, and the like are represented as a typical compound. A hole-injection layer may be provided between the pixel electrodes 502 and 503 and the hole-transporting layer 505 depending on the work function of the surfaces of the pixel electrodes 502 and 503. Furthermore, although the hole-transporting layer 505 is provided as a continuous layer covering the pixel electrodes 502 and 503 and the bank 504, it may be formed individually for the pixel electrodes 502 and 503.

Next, as shown in FIG. 5C, emission layers 506 and 506 are formed over the hole-transporting layer 505. In FIG. 5C, the emission layer 506 is formed in a region overlapping with the pixel electrode 502, whereas the light-emitting layer 507 is formed in a region overlapping with the pixel electrode 503. This is because emission layers including different materials are individually prepared in view of the emission color of each pixel. In FIG. 5C, a mask 550 having an opening in the region overlapping with the pixel electrode 502 is arranged parallel to the substrate to form the emission layer 506, by which the emission layer 506 is not formed in the region overlapping with the pixel electrode 503. When the emission layer 507 is formed over the pixel electrode 503, a mask 550 having an opening in a different position is used, and the emission layer 507 is formed only in the region overlapping with the pixel electrode 503. As shown in FIG. 5C, in the case where the emission layers are prepared individually according to the emission color, masks with the number equal to the number of the emission colors are used, and the aforementioned process is repeated. As an alternative method, similar to the formation of the hole-transporting layer 505 and the like, an emission layer continuously extending from over the pixel electrode 502 to over the pixel electrode 503 may be formed by using a material from which white emission is obtained. In this case, the emission color is controlled with a color filter or a color-conversion layer additionally fabricated.

As a material for the emission layers 506 and 507, a metal complex such as an aluminum complex, an iridium complex, and a beryllium complex is typically represented. Moreover, the emission layers 506 and 507 may be fabricated by using the aforementioned materials as a host material and co-evaporating a slight amount of a dopant. As a dopant material in such a case, perylene, rubrene, coumarin, and the like are representative. The aforementioned materials are respectively selected depending on the emission color desired for the emission layers 506 and 507.

Next, as shown in FIG. 5D, an electron-transporting layer 508 is formed over the hole-transporting layer 505 and the emission layers 506 and 507. As an electron-transporting material, a triazole derivative, an oxadiazole derivative, or the like is preferred, and BND, PBD, TAZ, OXD, and the like are represented as a representative compound. In FIG. 5D, the electron-transporting layer 508 is formed as a continuous layer covering the hole-transporting layer 505 and the emission layers 506 and 507. However, the electron-transporting layer 508 may be formed individually over each of the pixel electrodes 502 and 503.

Next, as shown in FIG. 5E, an opposing electrode 509 is formed over the electron-transporting layer 508. Since the opposing electrode 509 serves as a cathode of the organic EL element, a material with a low work function is preferred. MgAg, Al, or the like is typically used. Since these materials are a metal material, they are usually formed as a reflective electrode. In the case of a bottom-emission mode, the opposing electrode 509 may be used as a reflective electrode. However, in the case of a top-emission mode, the aforementioned metal material is processed to a thin film with a thickness of approximately 10 nm to several tens of nanometers so as to have a transmitting property to some extent because the opposing electrode 509 is required to transmit the emitted light. The opposing electrode 509 may be prepared with a transparent conductive material such as ITO, IZO, and ZnO. In this case, an electron-injection layer may be provided between the electron-transporting layer 508 and the opposing electrode 509 because a work function of these materials is relatively high.

Through these processes, the fabrication of an organic EL element is completed. Since an organic EL element is readily degraded by moisture in air, it is preferred to avoid exposure to air in each film-forming step and during transportation of a substrate to be treated between the film-forming steps. Therefore, it is preferred to configure the manufacturing apparatus so that the inside thereof is kept under a vacuum or an atmosphere of a specific gas and that a substrate to be treated is transported therein.

Additionally, since the degradation promoted by moisture in air may proceed after fabrication of an organic EL element is completed, a sealing film may be formed as shown in FIG. 5F with a purpose of preventing exposure of an organic EL element to air. Here, the sealing film is prepared as a three-layer structure of a silicon nitride film 510, an organic resin film 511, and a silicon nitride film 512. Since the formation of the silicon nitride film 510 as the lowest layer of the sealing film provides a high dampproofing property, the following formation of the organic resin film 511 and the like may be performed under air. This sealing film is also useful from a viewpoint of preventing attachment of foreign objects to an organic EL element or damage to the stacked film by sharp foreign objects.

FIG. 4 shows a conventional manufacturing apparatus of a light-emitting element in which treatment devices A to E are connected in series between an inlet 401 for a substrate and an outlet 402 for a substrate through transfer devices 421 to 424 and conveyors 411 and 412. A substrate to be treated input from the inlet 401 passes through the treating devices A, B, C, D, and E in this order.

In such a structure, in the case where the treatment order is changed, for example, in the case where a treatment is conducted in the treatment device D instead of the treatment device B immediately after a treatment in the treatment device A, the substrate must pass through the treatment devices B and C interposed therebetween. That is, since the treatment device is arranged on a flow line of the substrate, treatments of a substrate in the treatment devices B and C cannot be conducted after a treatment in the treatment device A is completed and until a treatment in the treatment device D is started. Moreover, an attempt to add a new treatment device F between the treatment devices A and B requires movement of at least the treatment device A, the conveyor 411, and the inlet 401. Hence, in the conventional manufacturing apparatus of a light-emitting element shown in FIG. 4, variation of the apparatus structure due to a change or addition of a process cannot be readily conducted. Additionally, as described above, when a specific treatment device in the middle part works as a bottleneck, it is difficult in the conventional structure to apply a method whereby this section is made parallel to increase throughput of the whole process.

In addition, the inlet 401 and the outlet 402 of the manufacturing apparatus of a light-emitting element shown in FIG. 4 are separated because the devices are connected in series. On the other hand, in the manufacturing apparatus of a light-emitting element according to an embodiment of the present invention shown in FIG. 1, input and output of a substrate to be treated are accomplished with the inlet/outlet 110, which provides an advantage that the substrate to be treated can be readily transferred to/from the other devices and the stocker. Such a structure in which an inlet and an outlet are commonly provided is called an inter-back mode. The inter-back mode is applied not only to the inlet/outlet 110 but also to the treatment devices A to E because the input and output from/to the respective devices are achieved by the conveyors 131 to 135. Furthermore, the employment of the inter-back mode in each treatment device allows the treatment devices to be arranged in a branch shape with respect to the main transporting route, by which layout of the devices and connection between the devices are facilitated and provided with a high degree of freedom. Of course, since the inlet and outlet for a substrate may be preferably separated depending on an environment where the treatment devices are arranged, the structure may be appropriately selected.

Moreover, the main transporting route of FIG. 1, which is structured by the inlet/outlet 110 for a substrate, the transfer devices 101 to 103, and the conveyors 111 to 113, may have a cyclic structure by further connecting a head of a vacant port 180 of the transfer device 103, which is not on a side connected to the conveyor 113, to the inlet/outlet 110. In this case, the manufacturing apparatus is not strictly the inter-back mode but is almost the same as the inter-back mode because a substrate to be treated is transferred on and around the main transporting route, returned to the inlet/outlet 110, and then recovered.

A specific example is shown in FIG. 7. In a manufacturing apparatus 700 of a light-emitting element, the inlet/outlet 110 for a substrate is connected to a conveyor 731, and a substrate to be treated is transferred between the inlet/outlet 110 and the conveyor 731. A cyclic path constructed by the transfer devices 701 to 708 and conveyors 731 to 738 is the main transporting route. The treatment device can be connected to each transfer device, via a sub-transporting route, through a port other than the ports connected to the conveyors forming the main transporting route. In FIG. 7, the treatment devices B to H and J to L indicated with dotted lines can be further connected in addition to the treatment device A indicated by solid lines. In the example of FIG. 7, one or two treatment devices are connected, via the sub-transporting route, to each of the transfer devices 701 to 708 on the main transporting route. However, three or more treatment devices may be connected as long as an arrangement space permits.

Additionally, focus placed on the number of the chambers connected to each treatment device reveals that a substrate-inlet face for receiving a substrate from the treatment device of the preceding process and a substrate-outlet face for transporting the substrate to the treating device of the following process are independently necessary for each treatment chamber according to the conventional structure shown in FIG. 4. On the other hand, in the structure according to an embodiment of the present invention shown in FIG. 1, the substrate-inlet face can be the same as the substrate-outlet face because the treatment devices are arranged in a branch shape from the main transporting route. In other words, there is an advantage that the number of the chambers connectable to one treatment device is larger by one.

From the aforementioned viewpoint, superiority of the structure of the manufacturing apparatus of a light-emitting element according to an embodiment of the present invention is extremely remarkable.

Technical characteristics of the manufacturing device and the manufacturing method of a light-emitting element according to an embodiment of the present invention are listed below as a supplementary note.

A manufacturing apparatus of a light-emitting element according to an embodiment of the present invention includes: a main transporting route having first and second transfer devices connected through a first transporting chamber; a sub-transporting route extending in a direction intersecting with the main transporting route, the sub-transporting route having a second transporting chamber connected to the first or second transfer device and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber. A region to which the first and second transfer devices, the first transporting chamber, and the second transporting chamber are connected is under a continuous vacuum environment.

The first transfer device or the second transfer device includes: a first port to which the first transporting chamber is connected; a second port to which the second transporting chamber is connected; and a third port to which a buffer for storing a substrate to be treated is connected. The buffer is under a vacuum environment continuous to the first or second transfer device connected through the third port.

A manufacturing apparatus for a light-emitting element according to an embodiment of the present invention includes: a main transporting route having first and second transfer devices connected through a first transporting chamber; a delivery chamber connected to the first or second transfer device through the second transporting chamber in a direction intersecting with the main transporting route; and a plurality of treatment chambers connected to the delivery chamber. The first transfer device or the second transfer device has a first port to which the first transporting chamber is connected, a second port to which the second transporting chamber is connected, and a third port to which a buffer for storing a substrate to be treated is connected. The delivery chamber has a fourth port to which the second transporting chamber is connected and a fifth port to which one of the plurality of treatment chambers is connected. At least two first transporting chambers are arranged in parallel.

The first to third ports are arranged radiatively with the first or second transfer device as a center. The first transfer device or the second transfer device has two first ports and two second ports. The first ports are arranged at two nonadjacent positions of the first or second transfer device. The second ports are arranged at two nonadjacent positions of the first or second transfer device. The third port is arranged between the first port and the second port.

The plurality of treatment chambers is arranged radiatively with the delivery chamber as a center.

The first to third ports each have airtightness.

The first to fifth ports each have airtightness.

The manufacturing device further possesses an inlet/outlet for a substrate at the first port of the first or second transfer device located at a terminal of the main transporting route. Input of the substrate before treatment and output of the substrate after treatment each are carried out through the inlet/outlet.

The manufacturing device further possesses: an inlet for a substrate at the first port of the first or second transfer device located at one of terminals of the main transporting route; and an outlet for a substrate at the first port of the first or second transfer device located at the other of the terminals of the main transporting route. Input of the substrate before treatment is carried out through the inlet, and output of the substrate after treatment is carried out through the outlet.

The manufacturing device further possesses: a third transfer device and a fourth transfer device on the main transporting route; and an inlet/outlet for a substrate at one of first ports of the third transfer device. The inlet/outlet is connected to one of first ports of the fourth transfer device. The main transporting route has a cyclic path passing through the first transfer device, the first transporting chamber, the second transfer device, the third transfer device, and the inlet/outlet. Input of the substrate before treatment and output of the substrate after treatment are carried out through the inlet/outlet.

The main transporting route has an unicursal shape.

A plurality of first transporting chambers is connected in series between the first and second transfer devices.

The first transporting chamber is disposed at an intersection of the main transporting route and the sub-transporting route. The manufacturing apparatus is configured so that a substrate to be treated is transported from the main transporting route to the sub-transporting route or from the sub-transporting route to the main transporting route.

An embodiment of the present invention is a manufacturing method of a light-emitting element with a manufacturing apparatus for a light-emitting element. The manufacturing apparatus includes: a main transporting route including a first and second transfer device connected to each other through a first transporting chamber; a first delivery chamber connected to the first transfer device through a second transporting chamber in a direction intersecting with the main transporting route; a second delivery chamber connected to the second transfer device through a third transporting chamber, the first delivery chamber extending from the first transfer device in a direction intersecting with the main transporting route; a first treatment chamber connected to the first delivery chamber; and a second treatment chamber connected to the second delivery chamber. The manufacturing method includes: preparing a substrate to be treated, the substrate including, over an insulating surface, a pixel electrode and a bank covering an edge portion of the pixel electrode and exposing a part of the pixel electrode; transporting the substrate to the first transfer device on the main transporting route of the manufacturing apparatus; transporting the substrate from the first transfer device to the first delivery chamber through the second transporting chamber; transporting the substrate from the first delivery chamber to the first treatment chamber connected to the first delivery chamber; forming a first organic layer over the pixel electrode and the bank; returning the substrate from the first treatment chamber to the first delivery chamber; returning the substrate from the first delivery chamber to the first transfer device through the second transporting chamber; transporting the substrate from the first transfer device to the second transfer device on the main transporting route; transporting the substrate from the second transfer device to the second delivery chamber through the third transporting chamber; transporting the substrate from the second delivery chamber to the second treatment chamber connected to the second delivery chamber; forming a second organic layer over the first organic layer in a region overlapping with the pixel electrode; returning the substrate from the second treatment chamber to the second delivery chamber; and returning the substrate from the second delivery chamber to the second transfer device through the third transporting chamber. The substrate is placed under a vacuum environment throughout the main transporting route, the second transporting chamber, the first delivery chamber, the first treatment chamber, the third transporting chamber, the second delivery chamber, and the second treatment chamber.

The manufacturing apparatus further possesses a third treatment chamber connected to the first delivery chamber. The manufacturing method further includes, after forming the second organic layer: transporting the substrate from the second transfer device to the first transfer device; transporting the substrate from the first transfer device to the first delivery chamber through the first sub-transporting route; transporting the substrate from the first delivery chamber to the third treatment chamber; and forming a third organic layer over the first organic layer and the second organic layer. The substrate is placed under a vacuum environment in the third treatment chamber.

The manufacturing apparatus further possesses: a third transfer device on the main transporting route, the third transfer device being connected to the first transfer device or the second transfer device through a fourth transporting chamber; a second sub-transporting route extending in a direction intersecting with the main transporting route, the second sub-transporting route including a third delivery chamber connected to the third transfer device through a fifth transporting chamber; and a third treatment chamber connected to the third delivery chamber. The manufacturing method further includes, after forming the second organic layer: transporting the substrate from the second transfer device to the third transfer device; transporting the substrate from the third transfer device to the third delivery chamber through the fifth transporting chamber; transporting the substrate from the third delivery chamber to the third treatment chamber; and forming a third organic layer over the first organic layer and the second organic layer. The substrate is placed under a vacuum environment throughout the fourth transporting chamber, the fifth transporting chamber, the third delivery chamber, and the third treatment chamber.

The first organic layer includes a hole-transporting layer or an electron-transporting layer of the light-emitting element.

The second organic layer includes an emission layer of the light-emitting element.

The first organic layer includes one of a hole-transporting layer and an electron-transporting layer of the light-emitting element, and the third organic layer includes the other of the hole-transporting layer and the electron-transporting layer of the light-emitting element.

The manufacturing apparatus possesses a buffer connected to the first transfer device or the second transfer device. The manufacturing method includes a step for transporting the substrate from the first transfer device or the second transfer device to the buffer.

The manufacturing apparatus possesses a buffer connected to one of the first transfer device, the second transfer device, and the third transfer device. The manufacturing method further includes a step for transporting the substrate from one of the first transfer device, the second transfer device, and the third transfer device to the buffer. 

What is claimed is:
 1. A manufacturing apparatus of a light-emitting element, the manufacturing apparatus comprising: a main transporting route extending in a first direction, the main transporting route including a first transfer device and a second transfer device connected to each other through a first transporting chamber; a sub-transporting route extending in a second direction intersecting with the first direction, the sub-transporting route comprising: a second transporting chamber connected to the first transfer device or the second transfer device; and a delivery chamber connected to the second transporting chamber; and a plurality of treatment chambers connected to the delivery chamber, wherein a region to which the first transfer device, the second transfer device, the first transporting chamber, and the second transporting chamber are connected is configured to be under a continuous vacuum environment.
 2. The manufacturing apparatus according to claim 1, wherein the first transfer device or the second transfer device further comprises: a first port to which the first transporting chamber is connected; a second port to which the second transporting chamber is connected; and a third port to which a buffer for storing a substrate to be treated is connected, and the buffer is configured to be under a vacuum environment continuous to the first transfer device or the second transfer device connected to the buffer through the third port.
 3. The manufacturing apparatus according to claim 2, wherein the delivery chamber further comprises a fourth port to which the second transporting chamber is connected and a fifth port to which one of the plurality of treatment chambers is connected.
 4. The manufacturing apparatus according to claim 1, wherein one or more first transporting chambers are arranged in parallel between the first transfer device and the second transfer device.
 5. The manufacturing apparatus according to claim 2, wherein the first transfer device or the second transfer device comprises two first ports and two second ports, the first to third ports are arranged radially with the first transfer device or the second transfer device as a center, the first ports are arranged at two nonadjacent positions of the first transfer device or the second transfer device, the second ports are arranged at two nonadjacent positions of the first transfer device or the second transfer device, and the third port is arranged between the first port and the second port.
 6. The manufacturing apparatus according to claim 2, wherein the plurality of treatment chambers is arranged radiatively with the delivery chamber as a center.
 7. The manufacturing apparatus according to claim 2, wherein each of the first to third ports has airtightness.
 8. The manufacturing apparatus according to claim 3, wherein each of the fourth and fifth ports has airtightness.
 9. The manufacturing apparatus according to claim 2, further comprising: an inlet/outlet for a substrate at the first port of the first transfer device or the second transfer device located at a terminal of the main transporting route, wherein the manufacturing apparatus is configured so that input of the substrate before treatment and output of the substrate after treatment are carried out through the inlet/outlet.
 10. The manufacturing apparatus according to claim 2, further comprising: an inlet for a substrate at the first port of the first transfer device or the second transfer device located at one of terminals of the main transporting route; and an outlet for a substrate at the first port of the first transfer device or the second transfer device located at the other terminal of the main transporting route, wherein the manufacturing apparatus is configured so that input of the substrate before treatment is carried out through the inlet, and output of the substrate after treatment is carried out through the outlet.
 11. The manufacturing apparatus according to claim 2, further comprising: a third transfer device on the main transporting route, the third transfer device having a first port; and an inlet/outlet for a substrate connected to the first ports of the third transfer device, wherein the first transfer device or the second transfer device comprises a fourth port, the inlet/outlet is connected to the fourth port, the main transporting route has a cyclic path passing through the first transfer device, the first transporting chamber, the second transfer device, the third transfer device, and the inlet/outlet, and the manufacturing apparatus is configured so that input of the substrate before treatment is carried out through the inlet/outlet, and output of the substrate after treatment is carried out through the inlet/outlet.
 12. The manufacturing apparatus according to claim 1, wherein the main transporting route has an unicursal shape.
 13. The manufacturing apparatus according to claim 1, wherein the first transporting chamber is disposed at a position where the sub-transporting route is connected to the main transporting route, and the manufacturing apparatus is configured so that a substrate to be treated is transported from the main transporting route to the sub-transporting route or from the sub-transporting route to the main transporting route.
 14. A manufacturing method for manufacturing a light-emitting element with a manufacturing apparatus, the manufacturing apparatus comprising: a main transporting route extending in a first direction, the main transporting route including a first transfer device and a second transfer device connected to each other through a first transporting chamber; a first delivery chamber connected to the first transfer device through a second transporting chamber in a second direction intersecting with the first direction; a second transporting chamber connected to the second transfer device through a third transporting chamber in the second direction or a third direction which intersects with the first direction or the second direction; a first treatment chamber connected to the first delivery chamber; and a second treatment chamber connected to the second delivery chamber, the manufacturing method comprising: preparing a substrate to be treated, the substrate including, over an insulating surface, a pixel electrode and a bank covering an edge portion of the pixel electrode and exposing a part of the pixel electrode; transporting the substrate into the first transfer device on the main transporting route of the manufacturing apparatus; transporting the substrate from the first transfer device to the first delivery chamber through the second transporting chamber; transporting the substrate from the first delivery chamber to the first treatment chamber connected to the first delivery chamber; forming a first organic layer over the pixel electrode and the bank; returning the substrate from the first treatment chamber to the first delivery chamber; returning the substrate from the first delivery chamber to the first transfer device through the second transporting chamber; transporting the substrate from the first transfer device to the second transfer device on the main transporting route; transporting the substrate from the second transfer device to the second delivery chamber through the third transporting chamber; transporting the substrate from the second delivery chamber to the second treatment chamber connected to the second delivery chamber; forming a second organic layer over the first organic layer in a region overlapping with the pixel electrode; returning the substrate from the second treatment chamber to the second delivery chamber; and returning the substrate from the second delivery chamber to the second transfer device through the third transporting chamber, wherein the substrate is placed under a vacuum environment throughout the main transporting route, the second transporting chamber, the first delivery chamber, the first treatment chamber, the third transporting chamber, the second delivery chamber, and the second treatment chamber.
 15. The manufacturing method according to claim 14, wherein the manufacturing apparatus further comprises a third treatment chamber connected to the first delivery chamber, the manufacturing method further includes, after forming the second organic layer: transporting the substrate from the second transfer device to the first transfer device; transporting the substrate from the first transfer device to the first delivery chamber through the first sub-transporting route; transporting the substrate from the first delivery chamber to the third treatment chamber; and forming a third organic layer over the first organic layer and the second organic layer, and the substrate is placed under a vacuum environment in the third treatment chamber.
 16. The manufacturing method according to claim 14, wherein the manufacturing apparatus further comprises: a third transfer device on the main transporting route, the third transfer device being connected to the first transfer device or the second transfer device through a fourth transporting chamber; a third delivery chamber connected to the third transfer device through a fifth transporting chamber in a direction intersecting with the main transporting route; and a third treatment chamber connected to the third delivery chamber, the manufacturing method further includes, after forming the second organic layer: transporting the substrate from the second transfer device to the third transfer device; transporting the substrate from the third transfer device to the third delivery chamber through the fifth transporting chamber; transporting the substrate from the third delivery chamber to the third treatment chamber; and forming a third organic layer over the first organic layer and the second organic layer, and the substrate is placed under a vacuum environment throughout the fourth transporting chamber, the fifth transporting chamber, the third delivery chamber, and the third treatment chamber.
 17. The manufacturing method according to claim 14, wherein the first organic layer includes a hole-transporting layer or an electron-transporting layer of the light-emitting element.
 18. The manufacturing method according to claim 14, wherein the second organic layer includes an emission layer of the light-emitting element.
 19. The manufacturing method according to claim 15, wherein the first organic layer includes one of a hole-transporting layer and an electron-transporting layer of the light-emitting element, and the third organic layer includes the other of the hole-transporting layer and the electron-transporting layer of the light-emitting element.
 20. The manufacturing method according to claim 16, wherein the first organic layer includes one of a hole-transporting layer and an electron-transporting layer of the light-emitting element, and the third organic layer includes the other of the hole-transporting layer and the electron-transporting layer of the light-emitting element.
 21. The manufacturing method according to claim 14, wherein the manufacturing apparatus comprises a buffer connected to the first transfer device or the second transfer device, and the manufacturing method includes a step for transporting the substrate from the first transfer device or the second transfer device to the buffer.
 22. The manufacturing method according to claim 16, wherein the manufacturing apparatus comprises a buffer connected to one of the first transfer device, the second transfer device, and the third transfer device, and the manufacturing method further includes a step for transporting the substrate from one of the first transfer device, the second transfer device, and the third transfer device to the buffer. 